Information about the enquirer
Outline (see graphic enclosure)
Deliveries
In pieces
In a panel
Base material
FR1
FR2
FR4
CEM1
Other
Number of sides (layers)
1
2
4
8
10
Other
Thickness of base material [mm]
0,20 0,40 0,50 0,60 0,80 1,00 1,20 1,50 1,60 2,00 2,40 3,20 Other
Thickness of copper [µm]
17,5 35 70 105
Min. line width [mm]
0,10 0,12 0,15 0,20 0,25 0,30 0,40 0,50 0,80
Min. conductor spacing [mm]
0,10 0,12 0,15 0,20 0,25 0,30 0,40 0,50 0,80
Minimal hole diameter [mm]
Solder mask
none
1-sided
2-sided
Removable mask
none
1-sided
2-sided
Carbon print (contacts)
none
1-sided
2-sided
Silk screen printing
none
1-sided
2-sided
Surface finish
OSP HAL - with lead HAL - without lead Gold Other
Board outline
V - scored
routed
punched
SMD technology
none
1-sided
2-sided
